Methodology — verify CrystalSim yourself
Every equation, every default parameter, every citation, every known limitation. Plus a downloadable Python kit so you can re-run the math without trusting our JavaScript.
Compact-model documentation
For each architecture, the exact equations, defaults, validity range, and primary citation. Implementations live in src/lib/physics/.
Planar bulk MOSFET
I_D,sat = ½ · (W/L) · μ_eff · C_ox · (V_GS − V_th)² I_D,lin = (W/L) · μ_eff · C_ox · [(V_GS−V_th)·V_DS − V_DS²/2] I_sub = I₀ · exp((V_GS − V_th) / (n · V_T)), V_T = kT/q C_ox = ε_r · ε₀ / t_ox
- · μ₀ = 1400 cm²/V·s (Si)
- · n = 1.1
- · t_ox = 2 nm
- · ε_r,ox = 3.9 (SiO₂)
- · I₀ = 1×10⁻¹¹ A
L ≥ 90 nm, V_DS ≤ 1.5 V, T ∈ [200, 400] K. No DIBL, no velocity saturation.
FinFET (BSIM-CMG inspired)
I_D = (W_eff/L_eff) · μ_eff · C_ox · [V_GT·V_DS − V_DS²/2] · (1 + λ·V_DS) V_GT = V_GS − V_th V_th = V_th0 − DVT · V_DS − DVT_B · V_BS μ_eff = μ₀ / (1 + θ · V_GT) W_eff = 2·H_fin + T_fin
- · μ₀ = 1400 (Si)
- · θ = 0.05 V⁻¹
- · λ = 0.05 V⁻¹
- · DVT = 0.04 V/V
- · n = 1.05
- · ssFactor = 1.05× ideal
Fin pitch ≥ 22 nm, H_fin ≤ 50 nm, V_DS ≤ 1.0 V. No quantum confinement below 5 nm.
Gate-All-Around nanosheet (BSIM-IMG inspired)
C_ox,eff = ε_ox/t_ox · (perimeter/W_nominal) I_D = (W/L) · μ_eff · C_ox,eff · [V_GT·V_DS − V_DS²/2] V_th = V_th0 − γ·(√(2φ_F + V_SB) − √(2φ_F)) SS ≈ 60 mV/dec · n, n → 1.0 in ideal GAA
- · Stack = 3 sheets × 6 nm × 30 nm
- · μ₀ = 1400
- · n = 0.98
- · leakageFactor = 0.18× FinFET
- · freqScale = 1.7× planar
Sheet thickness 4–8 nm, L ≥ 12 nm. Quantum confinement neglected below 4 nm.
Piezotronic FET
ΔΦ_B = e · ρ_piezo · W_dep / ε_s (barrier shift) ρ_piezo = d₃₃ · σ_applied (induced charge density) I_D ∝ exp(−q(Φ_B0 + ΔΦ_B)/kT) · (1 − exp(−qV_DS/kT)) V_piezo = (d₃₃ · σ · L) / (ε_r · ε₀) (open-circuit gating voltage)
- · ZnO d₃₃ = 12.4 pC/N
- · σ_max = 100 MPa
- · ssFactor = 0.55× thermal limit (sub-60 mV/dec achievable)
- · Boundary: clamped (k² correction applied)
σ ≤ σ_yield (≈100 MPa for ZnO film), wurtzite c-axis aligned with current. Linear piezo regime only.
Crystal-EM Hybrid (this work)
I_D,hyb = I_D,GaN(V_GS_eff, V_DS) · (1 + κ · η_EM) V_GS_eff = V_GS + V_piezo(σ_local) κ = clamp01(d₃₃ · σ_max / (100 · V_th)) [from PZT layer] η_EM = clamp01(Q / Q_critical) [from resonator] CEF = (μ_GaN_2DEG / μ_Si) · (1 + κ · η_EM)
- · μ_2DEG = 1800 cm²/V·s (AlGaN/GaN)
- · d₃₃ = 400 pC/N (PZT)
- · Q = 70, Q_critical = 100
- · σ_max = 100 MPa
- · freqScale = 2.6× planar
- · leakageFactor = 0.08×
Pre-publication — no fabricated device data exists. Treat all numbers as upper-bound projections derived from individual material properties.
Material database with citations
Single source of truth for all 8 crystals. Numbers below match src/data/crystals.ts.
| Material | μ_e (cm²/V·s) | E_g (eV) | d₃₃ (pC/N) | ε_r | κ_th (W/m·K) | E_brk (MV/cm) | Citation |
|---|---|---|---|---|---|---|---|
Silicon Si | 1400 | 1.12 | 0 | 11.7 | 150 | 0.3 | Sze, Physics of Semiconductor Devices, 4th ed. |
Quartz α-SiO₂ | 1 | 9 | 2.3 | 4.5 | 1.4 | 10 | Bechmann, Phys. Rev. 1958. |
Zinc Oxide ZnO | 200 (film 5–100) | 3.37 | 12.4 | 8.5 | 50 | 5 | Look, Mater. Sci. Eng. B, 2001. |
Gallium Nitride GaN | Bulk: 1000 | 2DEG: 1800 | 3.4 | 3.7 | 9 | 130 | 3.3 | Mishra et al., Proc. IEEE, 2008; Bernardini, Fiorentini & Vanderbilt, Phys. Rev. B 1997 (d₃₃). |
InGaOx InGaOₓ | 44.5 (film 10–50) | 3.5 | 0 | 13 | 5 | 5 | Nomura et al., Nature 2004; Tokyo VLSI Symp. 2025. |
PZT Pb(Zr,Ti)O₃ | 0.1 | 3.4 | 400 | 1300 | 1.8 | 0.5 | Jaffe, Cook & Jaffe, Piezoelectric Ceramics, 1971. |
Molybdenum Disulfide MoS₂ | 200 (film 50–200) | 1.8 | 3.7 | 4 | 34 | 8 | Radisavljevic et al., Nature Nanotech. 2011; Cui et al., Nature Comm. 2015. |
Lithium Niobate LiNbO₃ | 1 | 4 | 6 | 28 | 5.6 | 0.3 | Weis & Gaylord, Appl. Phys. A 1985. |
DOI links and full citation list: /brief/references
Simon's Law — derivation
- Step 1Start with effective Moore's Law (post-2020 silicon trajectory)
P_Si(t) = P₀ · 2^((t − t₀) / τ_eff)
τ_eff ≈ 3.5 yr captures the empirical post-2020 deceleration; classical Moore τ = 2 yr no longer fits foundry data (IRDS 2024).
- Step 2Define the Crystal-EM Enhancement Factor
CEF = (μ_crystal / μ_Si) · (1 + κ · η_EM)
Two multiplicative gains: a steady-state mobility ratio μ_crystal/μ_Si (mobility of 1400 cm²/V·s) and a dimensionless dynamic enhancement κ·η_EM ∈ [0, 1].
- Step 3Show CEF is dimensionless
[pC/N · Pa] / [V] = [C·m⁻²·V⁻¹·V] / [V] = [F/m²] / [F/m²] = dimensionless ✓
μ ratio is dimensionless by construction. κ and η_EM are clamped ratios in [0, 1] (see §4). Therefore CEF is dimensionless and P(t) inherits whatever units P_Si carries (Hz, ops/s, ops/J, …).
- Step 4Multiplicative-trajectory assumption
Assume hybrid performance follows the silicon trajectory but scaled by CEF — i.e., the same calendar improvements (lithography, packaging, EDA) apply to the hybrid stack.
- Step 5Combine
P(t) = P_Si(t) · CEF ⇒ P(t) = P₀ · 2^((t−t₀)/τ_eff) · CEF
- Step 6When CEF > 1 vs CEF < 1
- CEF > 1 (Crystal-EM advantage): high-μ channel + non-zero κ·η_EM. e.g. GaN/PZT @ Q=70 → CEF ≈ 1.69.
- CEF < 1 (silicon wins): low-μ piezo material with no resonator (κ·η_EM → 0) — e.g. PZT-only "channel" → CEF ≈ 0.0001.
- Step 7Limitations of the formulation
- Linear superposition: assumes material and EM enhancements multiply, which is an approximation valid when ECCF ≪ 1.
- Ignores parasitic R/C/L of interconnect at the system level.
- Ignores thermal back-reaction (high CEF → high power density → higher T → lower μ).
- Assumes the silicon baseline τ_eff is unchanged by hybrid integration.
ECCF — derivation
- Step 1Direct piezoelectric effect
V_piezo = d₃₃ · σ · L / (ε_r · ε₀)
Stress σ on a crystal of length L produces an open-circuit voltage. d₃₃ in pC/N, σ in Pa, L in m.
- Step 2Compare to threshold to get the gating fraction
κ = clamp01( d₃₃ · σ_max / (100 · V_th) )
Ratio of piezo-induced gating voltage to V_th. The "100" normalisation absorbs the unit conversion (pC/N · MPa / V) and keeps κ ∈ [0,1] across realistic d₃₃ (12 → 600) and σ (10 → 200 MPa).
- Step 3Q-factor as resonance enhancement
η_EM = clamp01( Q / Q_critical ), Q_critical = 100
Q below Q_critical = incoherent / lossy; above = coherent EM-channel coupling. Linear ramp is the simplest defensible model in the absence of a fitted dataset.
- Step 4Both terms clamped to [0, 1]
Ensures ECCF is bounded — no runaway "CEF = ∞" predictions.
- Step 5Worked example: GaN / PZT @ 5 GHz
d₃₃ = 400 pC/N (PZT) σ_max = 100 MPa V_th = 0.7 V Q = 70 κ = clamp01(400 · 100 / (100 · 0.7)) = clamp01(571) = 1.000 η_EM = clamp01(70 / 100) = 0.700 ECCF = κ · η_EM = 0.700 CEF = (1800/1400) · (1 + 0.700) = 2.19Caveat: with the empirical normalisation, κ saturates fast for PZT-class materials. The dynamic range of ECCF is dominated by η_EM in this regime — exactly what we'd expect for a resonator-limited architecture.
Reproducibility kit
A self-contained ZIP — no web dependencies, runs in pure Python 3.8+.
README.md— how to run the kitmaterials.json— full crystal database (8 materials)architectures.json— 5 transistor architectures + parameterscompact_models.py— Python port of every equation in §1, §3, §4test_vectors.json— input/expected pairs; runpython3 compact_models.pyto verify
Known limitations — what CrystalSim does NOT do
- ·Does not solve Poisson–Schrödinger self-consistently
- ·Does not include quantum confinement corrections below 5 nm channel thickness
- ·Does not model band-to-band tunneling (BTBT)
- ·Does not model trap-assisted tunneling in defective films
- ·Does not run process-variation Monte Carlo
- ·Does not extract BEOL parasitic R/C/L
- ·Does not solve coupled thermal–electrical self-heating in steady state
- ·Does not include strain-relaxation or dislocation effects in lattice-mismatched stacks
- ·Does not account for ferroelectric hysteresis or fatigue in PZT gate
- ·Does not model EM crosstalk between adjacent resonators
For the items above, use industry tools
CrystalSim is a compact-model exploration tool, not a TCAD replacement. Use it for first-order architecture comparisons; use Sentaurus / Atlas for tape-out-grade verification.