CRYSTALSIM

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/methodology

Methodology — verify CrystalSim yourself

Every equation, every default parameter, every citation, every known limitation. Plus a downloadable Python kit so you can re-run the math without trusting our JavaScript.

Validation results
§1

Compact-model documentation

For each architecture, the exact equations, defaults, validity range, and primary citation. Implementations live in src/lib/physics/.

Planar bulk MOSFET

Si baseline · 1971–2011
Long-channel Sze model with Boltzmann subthreshold tail
I_D,sat  = ½ · (W/L) · μ_eff · C_ox · (V_GS − V_th)²
I_D,lin  = (W/L) · μ_eff · C_ox · [(V_GS−V_th)·V_DS − V_DS²/2]
I_sub    = I₀ · exp((V_GS − V_th) / (n · V_T)),  V_T = kT/q
C_ox     = ε_r · ε₀ / t_ox
Defaults
  • · μ₀ = 1400 cm²/V·s (Si)
  • · n = 1.1
  • · t_ox = 2 nm
  • · ε_r,ox = 3.9 (SiO₂)
  • · I₀ = 1×10⁻¹¹ A
Validity range

L ≥ 90 nm, V_DS ≤ 1.5 V, T ∈ [200, 400] K. No DIBL, no velocity saturation.

Citation: Sze & Ng, Physics of Semiconductor Devices, 4th ed., 2021, Ch. 6.

FinFET (BSIM-CMG inspired)

Current gen · 22nm–3nm
Long-channel core with body-factor V_th roll-off and mobility degradation
I_D = (W_eff/L_eff) · μ_eff · C_ox · [V_GT·V_DS − V_DS²/2] · (1 + λ·V_DS)
V_GT  = V_GS − V_th
V_th  = V_th0 − DVT · V_DS − DVT_B · V_BS
μ_eff = μ₀ / (1 + θ · V_GT)
W_eff = 2·H_fin + T_fin
Defaults
  • · μ₀ = 1400 (Si)
  • · θ = 0.05 V⁻¹
  • · λ = 0.05 V⁻¹
  • · DVT = 0.04 V/V
  • · n = 1.05
  • · ssFactor = 1.05× ideal
Validity range

Fin pitch ≥ 22 nm, H_fin ≤ 50 nm, V_DS ≤ 1.0 V. No quantum confinement below 5 nm.

Citation: BSIM-CMG 110.0.0 Technical Manual, UC Berkeley BSIM Group, Aug 2024.

Gate-All-Around nanosheet (BSIM-IMG inspired)

Cutting edge · Intel 18A / TSMC N2
Wrap-gated long-channel with double-gate-equivalent body factor
C_ox,eff = ε_ox/t_ox · (perimeter/W_nominal)
I_D = (W/L) · μ_eff · C_ox,eff · [V_GT·V_DS − V_DS²/2]
V_th = V_th0 − γ·(√(2φ_F + V_SB) − √(2φ_F))
SS  ≈ 60 mV/dec · n,  n → 1.0 in ideal GAA
Defaults
  • · Stack = 3 sheets × 6 nm × 30 nm
  • · μ₀ = 1400
  • · n = 0.98
  • · leakageFactor = 0.18× FinFET
  • · freqScale = 1.7× planar
Validity range

Sheet thickness 4–8 nm, L ≥ 12 nm. Quantum confinement neglected below 4 nm.

Citation: BSIM-IMG 103.0.0 Manual, Khandelwal et al., UC Berkeley, 2023.

Piezotronic FET

Strain-gated · research
Strain-modulated barrier height — Wang piezotronic theory
ΔΦ_B = e · ρ_piezo · W_dep / ε_s         (barrier shift)
ρ_piezo = d₃₃ · σ_applied                 (induced charge density)
I_D ∝ exp(−q(Φ_B0 + ΔΦ_B)/kT) · (1 − exp(−qV_DS/kT))
V_piezo = (d₃₃ · σ · L) / (ε_r · ε₀)     (open-circuit gating voltage)
Defaults
  • · ZnO d₃₃ = 12.4 pC/N
  • · σ_max = 100 MPa
  • · ssFactor = 0.55× thermal limit (sub-60 mV/dec achievable)
  • · Boundary: clamped (k² correction applied)
Validity range

σ ≤ σ_yield (≈100 MPa for ZnO film), wurtzite c-axis aligned with current. Linear piezo regime only.

Citation: Z.L. Wang, Adv. Mater. 19, 889 (2007); Wu & Wang, Nano Energy 1, 13 (2012).

Crystal-EM Hybrid (this work)

Thesis architecture
GaN 2DEG channel + PZT ferroelectric gate + EM-resonant coupler
I_D,hyb = I_D,GaN(V_GS_eff, V_DS) · (1 + κ · η_EM)
V_GS_eff = V_GS + V_piezo(σ_local)
κ      = clamp01(d₃₃ · σ_max / (100 · V_th))    [from PZT layer]
η_EM   = clamp01(Q / Q_critical)                 [from resonator]
CEF    = (μ_GaN_2DEG / μ_Si) · (1 + κ · η_EM)
Defaults
  • · μ_2DEG = 1800 cm²/V·s (AlGaN/GaN)
  • · d₃₃ = 400 pC/N (PZT)
  • · Q = 70, Q_critical = 100
  • · σ_max = 100 MPa
  • · freqScale = 2.6× planar
  • · leakageFactor = 0.08×
Validity range

Pre-publication — no fabricated device data exists. Treat all numbers as upper-bound projections derived from individual material properties.

Citation: CrystalSim Engineering Brief, 2026 (this site, /brief).
§2

Material database with citations

Single source of truth for all 8 crystals. Numbers below match src/data/crystals.ts.

Materialμ_e (cm²/V·s)E_g (eV)d₃₃ (pC/N)ε_rκ_th (W/m·K)E_brk (MV/cm)Citation
Silicon
Si
14001.12011.71500.3Sze, Physics of Semiconductor Devices, 4th ed.
Quartz
α-SiO₂
192.34.51.410Bechmann, Phys. Rev. 1958.
Zinc Oxide
ZnO
200 (film 5–100)3.3712.48.5505Look, Mater. Sci. Eng. B, 2001.
Gallium Nitride
GaN
Bulk: 1000 | 2DEG: 18003.43.791303.3Mishra et al., Proc. IEEE, 2008; Bernardini, Fiorentini & Vanderbilt, Phys. Rev. B 1997 (d₃₃).
InGaOx
InGaOₓ
44.5 (film 10–50)3.501355Nomura et al., Nature 2004; Tokyo VLSI Symp. 2025.
PZT
Pb(Zr,Ti)O₃
0.13.440013001.80.5Jaffe, Cook & Jaffe, Piezoelectric Ceramics, 1971.
Molybdenum Disulfide
MoS₂
200 (film 50–200)1.83.74348Radisavljevic et al., Nature Nanotech. 2011; Cui et al., Nature Comm. 2015.
Lithium Niobate
LiNbO₃
146285.60.3Weis & Gaylord, Appl. Phys. A 1985.

DOI links and full citation list: /brief/references

§3

Simon's Law — derivation

  1. Step 1
    Start with effective Moore's Law (post-2020 silicon trajectory)
    P_Si(t) = P₀ · 2^((t − t₀) / τ_eff)

    τ_eff ≈ 3.5 yr captures the empirical post-2020 deceleration; classical Moore τ = 2 yr no longer fits foundry data (IRDS 2024).

  2. Step 2
    Define the Crystal-EM Enhancement Factor
    CEF = (μ_crystal / μ_Si) · (1 + κ · η_EM)

    Two multiplicative gains: a steady-state mobility ratio μ_crystal/μ_Si (mobility of 1400 cm²/V·s) and a dimensionless dynamic enhancement κ·η_EM ∈ [0, 1].

  3. Step 3
    Show CEF is dimensionless
    [pC/N · Pa] / [V] = [C·m⁻²·V⁻¹·V] / [V] = [F/m²] / [F/m²] = dimensionless ✓

    μ ratio is dimensionless by construction. κ and η_EM are clamped ratios in [0, 1] (see §4). Therefore CEF is dimensionless and P(t) inherits whatever units P_Si carries (Hz, ops/s, ops/J, …).

  4. Step 4
    Multiplicative-trajectory assumption

    Assume hybrid performance follows the silicon trajectory but scaled by CEF — i.e., the same calendar improvements (lithography, packaging, EDA) apply to the hybrid stack.

  5. Step 5
    Combine
    P(t) = P_Si(t) · CEF ⇒ P(t) = P₀ · 2^((t−t₀)/τ_eff) · CEF
  6. Step 6
    When CEF > 1 vs CEF < 1
    • CEF > 1 (Crystal-EM advantage): high-μ channel + non-zero κ·η_EM. e.g. GaN/PZT @ Q=70 → CEF ≈ 1.69.
    • CEF < 1 (silicon wins): low-μ piezo material with no resonator (κ·η_EM → 0) — e.g. PZT-only "channel" → CEF ≈ 0.0001.
  7. Step 7
    Limitations of the formulation
    • Linear superposition: assumes material and EM enhancements multiply, which is an approximation valid when ECCF ≪ 1.
    • Ignores parasitic R/C/L of interconnect at the system level.
    • Ignores thermal back-reaction (high CEF → high power density → higher T → lower μ).
    • Assumes the silicon baseline τ_eff is unchanged by hybrid integration.
§4

ECCF — derivation

  1. Step 1
    Direct piezoelectric effect
    V_piezo = d₃₃ · σ · L / (ε_r · ε₀)

    Stress σ on a crystal of length L produces an open-circuit voltage. d₃₃ in pC/N, σ in Pa, L in m.

  2. Step 2
    Compare to threshold to get the gating fraction
    κ = clamp01( d₃₃ · σ_max / (100 · V_th) )

    Ratio of piezo-induced gating voltage to V_th. The "100" normalisation absorbs the unit conversion (pC/N · MPa / V) and keeps κ ∈ [0,1] across realistic d₃₃ (12 → 600) and σ (10 → 200 MPa).

  3. Step 3
    Q-factor as resonance enhancement
    η_EM = clamp01( Q / Q_critical ),  Q_critical = 100

    Q below Q_critical = incoherent / lossy; above = coherent EM-channel coupling. Linear ramp is the simplest defensible model in the absence of a fitted dataset.

  4. Step 4
    Both terms clamped to [0, 1]

    Ensures ECCF is bounded — no runaway "CEF = ∞" predictions.

  5. Step 5
    Worked example: GaN / PZT @ 5 GHz
    d₃₃ = 400 pC/N (PZT)
    σ_max = 100 MPa
    V_th = 0.7 V
    Q = 70
    
    κ     = clamp01(400 · 100 / (100 · 0.7))
          = clamp01(571)  = 1.000
    
    η_EM  = clamp01(70 / 100) = 0.700
    
    ECCF  = κ · η_EM = 0.700
    CEF   = (1800/1400) · (1 + 0.700) = 2.19

    Caveat: with the empirical normalisation, κ saturates fast for PZT-class materials. The dynamic range of ECCF is dominated by η_EM in this regime — exactly what we'd expect for a resonator-limited architecture.

§5

Reproducibility kit

A self-contained ZIP — no web dependencies, runs in pure Python 3.8+.

  • README.md — how to run the kit
  • materials.json — full crystal database (8 materials)
  • architectures.json — 5 transistor architectures + parameters
  • compact_models.py — Python port of every equation in §1, §3, §4
  • test_vectors.json — input/expected pairs; run python3 compact_models.py to verify
§6

Known limitations — what CrystalSim does NOT do

Honest scope
  • ·Does not solve Poisson–Schrödinger self-consistently
  • ·Does not include quantum confinement corrections below 5 nm channel thickness
  • ·Does not model band-to-band tunneling (BTBT)
  • ·Does not model trap-assisted tunneling in defective films
  • ·Does not run process-variation Monte Carlo
  • ·Does not extract BEOL parasitic R/C/L
  • ·Does not solve coupled thermal–electrical self-heating in steady state
  • ·Does not include strain-relaxation or dislocation effects in lattice-mismatched stacks
  • ·Does not account for ferroelectric hysteresis or fatigue in PZT gate
  • ·Does not model EM crosstalk between adjacent resonators

For the items above, use industry tools

Synopsys Sentaurus TCAD
Self-consistent Poisson–Schrödinger, BTBT, full process simulation
Silvaco Atlas
2D/3D device simulation with quantum corrections
Cogenda Genius
Open-academic TCAD with drift-diffusion + tunneling
QuantumATK
Atomistic NEGF for sub-5 nm channels

CrystalSim is a compact-model exploration tool, not a TCAD replacement. Use it for first-order architecture comparisons; use Sentaurus / Atlas for tape-out-grade verification.